Equipment composition forhot pressing bonding machine:

Thehot pressing bonding machineine yekumusoro yekutsikirira roller (yepamusoro yekutsikirira ndiro), yepasi yekutsikirira ndiro, silinda yemafuta, furemu, iyo tembiricha yemafuta hita yekudzora tembiricha.

Main michina parameters kutiPaperboard Hot Gluing Machine:

(1) Ukobvu hweakasungwa insulated kadhibhodhi chubhu: 2 ~ 8mm

(2) Diameter ye bonded insulated cardboard chubhu: 250-3500mm

(3) Kureba kweakasungwa insulated kadhibhodhi chubhu: 1500 ~ 4000mm

(4) Kupisa tembiricha: inochinjika kubva pa50 ℃ kusvika 150 ℃

(5) Tembiricha yekudzora kurongeka: ± 2 ℃

(6) Heating element: Magetsi kupisa (mafuta anopisa)

(7) Bonding pamusoro upamhi: 150mm (inogona kugadzirwa maererano mutengi zvinodiwa)

(8) Compaction nzira: Hydraulic pressure (system pressure: 12Mpa)